solder

['sɑ:dər]

n.焊接剂, 接合物
v.焊接

例句与用法：

He soldered the wire back on.

他把金属丝重新焊上去了。

词形变化：

名词: solderer | 动词过去式: soldered | 动词过去分词: soldered | 动词现在分词: soldering | 动词第三人称单数: solders |

n.[U]

1. 焊料, 焊锡

2. 接合物, 联结因素

vt.

1. 焊接

He soldered the broken wires together.

他将断了的电线焊接起来。

2. 使联接在一起

vi.

焊, 焊接起来

solder

过去式：soldered

过去分词：soldered

现在进行时：soldering

词形变化：

名词: solderer | 动词过去式: soldered | 动词过去分词: soldered | 动词现在分词: soldering | 动词第三人称单数: solders |

词义辨析：

同义:

vt.接合; 修补

cement

bind

weld

fuse

join

mend

fasten

同义参见:

fuse¹

adhesive

solder['sɔldə]n.1.■用以焊接的合金，(低温)焊料2.■接合物；连接因素vt.1.■焊，焊接，焊合：to solder the hull焊接船体2.■使连在一起，使联合：two fates inseparably soldered by misfortune福兮祸所伏3.■修补：to solder a pot焊修锅vi.1.■焊，焊接，焊合：to solder hard难焊接2.■联结，连在一起

1. [mass noun]a low-melting alloy, especially one based on lead and tin or (for higher temperatures) on brass or silver, used for joining less fusible metals
   焊料
   

1. [with obj.]join with solder
   焊接
   

1. Middle English: from Old French soudure, from the verb souder, from Latin solidare 'fasten together', from solidus 'solid'
   

solder

名词 solder:

an alloy (usually of lead and tin) used when melted to join two metal surfaces

动词 solder:

join or fuse with solder

形容词 sold:

disposed of to a purchaser

同义词：sold

solder

■The 1710 series threaded and solder end range are "T" pattern globe style valves.

1710系列螺纹和焊接连接端口为T形截止阀结构的阀门。

■More than 3 years working experiences in SMT processing and strong willing to be a technical sales in selling lead-free solder paste.

3年以上SMT生产线工艺制程控制经验,具有销售无铅锡膏产品的愿望。

■Solder side is chosen to measure.

4量测以吃锡面为选择点。

■More than 5 years working experiences in SMT process. Familiar with technical, equipment, process of lead-free solder paste.

5年以上SMT锡膏制程工作背景,熟悉无铅锡膏产品技术及生产工艺、设备、制程者。

■BGA measurement is measured for inside solder point.

BGA量测以最内侧焊点为量测依据。

■FCT Solder’s site provides detailed information about SN100C and its applications.

FCT焊料的网站提供详细资料，实绩及其应用。

■Q: Will IPC be publishing a new specification for inspection of lead-free solder joints?

IPC是否会颁布新的关于无铅焊接的质检标准?

■Northrop Grumman Corporation announces the introduction of PureMark 202 no-clean solder paste by Kester.

Northrop Grumman公司宣布,PureMark 202免清洗焊锡膏已由凯斯特推出。

■Northrop Grumman Corporation announces the introduction of FL250D, a no-clean solder paste by Kester.

Northrop Grumman公司宣布由凯斯特推出FL250D免清洗焊锡膏。

■RF742 is a No-Clean Paste Flux compatible with FL250D NO Clean Solder Paste.

RF742是一种可以与FL250D免清洗焊锡膏相容的免清洗焊锡膏。

■TCS-509-5042S(F12-1) is Lead free, RA type solder paste which is designed to be washable.

TCS-509-5042S(F12-1)是无铅活化松香型焊锡膏,可以水洗。

■TCS-531-1 uses fine solder powder and its flux system exhibits high reliability with high insulation and corrosion resistance.

TCS-531-1使用了精细焊料粉,其焊剂配系具有很高的可靠性,同时具有很高的绝缘和抗腐蚀能力。

■A general profile setting up a wave solder machine to optimize reflow using an alcohol base flux.

一种常规温度特性曲线,用于对波焊机进行设置,对采用以酒精为基本成分的焊剂回流进行优化。

■SMOBC: Solder mask over bare copper.

一种阻焊层覆盖裸铜的工艺。

■Type of high density solder mask.

一种高密度焊料掩膜。

■Generally the same fluxes will work for lead-free solder.

一般来说,相同的焊剂用于无铅焊料是有效的。

■Generally, solder alloys with more than about 8% bismuth will be brittle.

一般来说,铋含量超过8%的焊料合金将会变脆。

■Not all MCMs have Solder Balls or Leads to realize electrical connecting.

不是所有的MCM都采用焊球或引脚和外界相连。

■Do not solder directly to cells or batteries.

不要直接对电池进行焊接。

■The stainless tubing is less likely to kink than copper, but it is harder to solder without an acid treatment.

不锈钢管比铜管不易纠结，但不经酸性处理焊接较困难。

■Stencils for printing solder paste, glue. Laser cut, electric-formed, chemical itched.

丝印模板,锡浆网,胶水网

■To ensure good wetting and low voiding I believe I will pre clean and etch the solder (prefrom) to remove oxides.

为了保证良好的润湿性及低空洞率，我认为需要进行预清洗，并对焊片表面进行刻蚀以去除氧化物。

■To achieve the required bump heights, the solder paste is over-printed onto the wafer bond pads.

为了获得要求的凸起高度，锡膏在晶片焊盘过焊。

■Solder end valves also available.

也可以提供焊接连接端口的阀门。

■The amount of refund tax should be consult with the solder .

买单公司的退税金额应该和卖单企业商议。

■Gong Yoo who was enlisted as active solder in January is now serving as entertainment soldier.

于一月现役入伍服役的孔刘，现在正以艺能兵的身分服役中。

■So it will result in rigidity skin &block and solder balls etc.

产生的后果是：锡膏出现硬皮、硬块、难熔并产生大量锡球等。

■However, in the eutectic SnBi solder joints, the constituted elements are Sn and Bi.

但是，在共晶锡铋焊点中，组成的元素为锡和铋而非单一元素。

■Very low leakage current, compact, easy to use power entry filter with fast on tabs or solder terminals.

低漏电流,小巧,端子嵌入或焊锡,方便安装和使用。

■All electronics assemblies using lead in solder.

使用含铅焊料的所有电子配件。

■What are the patent issues with using lead-free solder?

使用无铅焊料涉及的专利问题有哪些?

■What are the main qualification tests for using lead-free solder paste?

使用无铅焊锡膏的主要评选测试有哪些?

■Stir solder paste in container before use.

使用时搅拌容器内的焊膏。

■Examples are insufficient solder, a misaligned component, a missing bypass capacitor and an open power pin.

例如，不够充足的焊料，元器件对准不佳、遗漏旁路电容和电源针开路。

■Separation of the component lead from the solder fillet.

元件面或焊锡面的零件脚旁焊锡裂开。

■The solder(Deltavave/DeltaMax) can ensure the quality in steady and can solder without lead (Pb) for request of environmental protection.

先进的充氮波峰焊炉，足以确保产品的焊接质量和板面清洁度，提高产品的可靠性和稳定性，并可进行无铅焊接，实现了与国际接轨。

■Bare laminate, copper, solder resist or other surface.

光面基材，覆铜板，绿油之或其它表面。

■Pb-free solder;BGA;thermal cycling;dynamic fatigue tests;electrical analysis.

关键词:无铅焊锡;球格阵列构装;冷热循环试验;动态疲劳试验;电性分析

■Other effects of lead-free solder paste demolding performance factors such as having a mesh size and aspect ratio.

其它感化无铅焊膏脱模本能机能的成分包含网孔尺寸和宽矮比。

■The company was founded in 1899 as the Chicago Solder Company to produce flux-cored solder.

凯斯特公司创立于1899年,当时公司名为芝加哥焊锡公司,主要产品是带有焊剂芯的焊锡。

■Kester has announced that it will open a facility in Nogales, Mexico to meet unprecedented industry demand for its interconnect solder materials.

凯斯特宣布它将在墨西哥Nogales设立工厂以满足互连焊锡膏材料方面的强劲需求。

■Flux: The material used to remove oxides from metal surfaces and enable wetting of the metal with solder.

助焊剂:用于除去金属表面氧化物并使焊料能润湿金属表面的材料。

■Is the upper and lower specification limits for individual Solder Paste height measurements also defined?

单点锡膏厚度测量是否定义了其控制上限和下限?

■Reflow solder paste in 2 hours as soon as possible after printing.

印刷后要在2小时内回流焊膏。

■The operator should use the solder paste quickly after it has been taken out.

取出的锡膏要尽快实施印刷使用。

■Atoms in the solder joints move as a result of both diffusion and electromigration.

另一方面，扩散和电迁移效应，则造成焊点中的原子移动。

■Only partial removal of the contaminated solder pot will get the Pb concentration back below 0.1% wt.

只有将被污染的焊料槽部分取下才可以让铅浓度恢复到重量0.1%以下。

■The reflow/extraction process should be carried out in accordance with J-STD-004 for the solder preforms.

可以按照针对预焊料的提取的J-STD-004进行回流/提取过程。

■Available with threaded (-UT), solder (-US), PEX or CPVC connections.

可提供螺纹连接（-UT），焊接连接（-US），PEX或CPVC连接方式。

■Settable for dipping time. Used solder cup to bring up tin from pot.

可设定焊锡时间,采用子式锡杯,母式锡炉.