solderer
n. 焊工
例句与用法:
He soldered the wire back on.
他把金属丝重新焊上去了。
词形变化:
名词: solderer | 动词过去式: soldered | 动词过去分词: soldered | 动词现在分词: soldering | 动词第三人称单数: solders |
solderer
词形变化:
名词: solderer | 动词过去式: soldered | 动词过去分词: soldered | 动词现在分词: soldering | 动词第三人称单数: solders |
solderer
名词 solderer:
a worker who joins or mends with solder
solderer
■The 1710 series threaded and solder end range are "T" pattern globe style valves.
1710系列螺纹和焊接连接端口为T形截止阀结构的阀门。
■More than 3 years working experiences in SMT processing and strong willing to be a technical sales in selling lead-free solder paste.
3年以上SMT生产线工艺制程控制经验,具有销售无铅锡膏产品的愿望。
■Solder side is chosen to measure.
4量测以吃锡面为选择点。
■More than 5 years working experiences in SMT process. Familiar with technical, equipment, process of lead-free solder paste.
5年以上SMT锡膏制程工作背景,熟悉无铅锡膏产品技术及生产工艺、设备、制程者。
■BGA measurement is measured for inside solder point.
BGA量测以最内侧焊点为量测依据。
■FCT Solder’s site provides detailed information about SN100C and its applications.
FCT焊料的网站提供详细资料,实绩及其应用。
■Q: Will IPC be publishing a new specification for inspection of lead-free solder joints?
IPC是否会颁布新的关于无铅焊接的质检标准?
■Northrop Grumman Corporation announces the introduction of PureMark 202 no-clean solder paste by Kester.
Northrop Grumman公司宣布,PureMark 202免清洗焊锡膏已由凯斯特推出。
■Northrop Grumman Corporation announces the introduction of FL250D, a no-clean solder paste by Kester.
Northrop Grumman公司宣布由凯斯特推出FL250D免清洗焊锡膏。
■RF742 is a No-Clean Paste Flux compatible with FL250D NO Clean Solder Paste.
RF742是一种可以与FL250D免清洗焊锡膏相容的免清洗焊锡膏。
■TCS-509-5042S(F12-1) is Lead free, RA type solder paste which is designed to be washable.
TCS-509-5042S(F12-1)是无铅活化松香型焊锡膏,可以水洗。
■TCS-531-1 uses fine solder powder and its flux system exhibits high reliability with high insulation and corrosion resistance.
TCS-531-1使用了精细焊料粉,其焊剂配系具有很高的可靠性,同时具有很高的绝缘和抗腐蚀能力。
■A general profile setting up a wave solder machine to optimize reflow using an alcohol base flux.
一种常规温度特性曲线,用于对波焊机进行设置,对采用以酒精为基本成分的焊剂回流进行优化。
■SMOBC: Solder mask over bare copper.
一种阻焊层覆盖裸铜的工艺。
■Type of high density solder mask.
一种高密度焊料掩膜。
■Generally the same fluxes will work for lead-free solder.
一般来说,相同的焊剂用于无铅焊料是有效的。
■Generally, solder alloys with more than about 8% bismuth will be brittle.
一般来说,铋含量超过8%的焊料合金将会变脆。
■Not all MCMs have Solder Balls or Leads to realize electrical connecting.
不是所有的MCM都采用焊球或引脚和外界相连。
■Do not solder directly to cells or batteries.
不要直接对电池进行焊接。
■The stainless tubing is less likely to kink than copper, but it is harder to solder without an acid treatment.
不锈钢管比铜管不易纠结,但不经酸性处理焊接较困难。
■Stencils for printing solder paste, glue. Laser cut, electric-formed, chemical itched.
丝印模板,锡浆网,胶水网
■To ensure good wetting and low voiding I believe I will pre clean and etch the solder (prefrom) to remove oxides.
为了保证良好的润湿性及低空洞率,我认为需要进行预清洗,并对焊片表面进行刻蚀以去除氧化物。
■To achieve the required bump heights, the solder paste is over-printed onto the wafer bond pads.
为了获得要求的凸起高度,锡膏在晶片焊盘过焊。
■Solder end valves also available.
也可以提供焊接连接端口的阀门。
■The amount of refund tax should be consult with the solder .
买单公司的退税金额应该和卖单企业商议。
■Gong Yoo who was enlisted as active solder in January is now serving as entertainment soldier.
于一月现役入伍服役的孔刘,现在正以艺能兵的身分服役中。
■So it will result in rigidity skin &block and solder balls etc.
产生的后果是:锡膏出现硬皮、硬块、难熔并产生大量锡球等。
■However, in the eutectic SnBi solder joints, the constituted elements are Sn and Bi.
但是,在共晶锡铋焊点中,组成的元素为锡和铋而非单一元素。
■Very low leakage current, compact, easy to use power entry filter with fast on tabs or solder terminals.
低漏电流,小巧,端子嵌入或焊锡,方便安装和使用。
■All electronics assemblies using lead in solder.
使用含铅焊料的所有电子配件。
■What are the patent issues with using lead-free solder?
使用无铅焊料涉及的专利问题有哪些?
■What are the main qualification tests for using lead-free solder paste?
使用无铅焊锡膏的主要评选测试有哪些?
■Stir solder paste in container before use.
使用时搅拌容器内的焊膏。
■Examples are insufficient solder, a misaligned component, a missing bypass capacitor and an open power pin.
例如,不够充足的焊料,元器件对准不佳、遗漏旁路电容和电源针开路。
■Separation of the component lead from the solder fillet.
元件面或焊锡面的零件脚旁焊锡裂开。
■The solder(Deltavave/DeltaMax) can ensure the quality in steady and can solder without lead (Pb) for request of environmental protection.
先进的充氮波峰焊炉,足以确保产品的焊接质量和板面清洁度,提高产品的可靠性和稳定性,并可进行无铅焊接,实现了与国际接轨。
■Bare laminate, copper, solder resist or other surface.
光面基材,覆铜板,绿油之或其它表面。
■Pb-free solder;BGA;thermal cycling;dynamic fatigue tests;electrical analysis.
关键词:无铅焊锡;球格阵列构装;冷热循环试验;动态疲劳试验;电性分析
■Other effects of lead-free solder paste demolding performance factors such as having a mesh size and aspect ratio.
其它感化无铅焊膏脱模本能机能的成分包含网孔尺寸和宽矮比。
■The company was founded in 1899 as the Chicago Solder Company to produce flux-cored solder.
凯斯特公司创立于1899年,当时公司名为芝加哥焊锡公司,主要产品是带有焊剂芯的焊锡。
■Flux: The material used to remove oxides from metal surfaces and enable wetting of the metal with solder.
助焊剂:用于除去金属表面氧化物并使焊料能润湿金属表面的材料。
■Is the upper and lower specification limits for individual Solder Paste height measurements also defined?
单点锡膏厚度测量是否定义了其控制上限和下限?
■Reflow solder paste in 2 hours as soon as possible after printing.
印刷后要在2小时内回流焊膏。
■The operator should use the solder paste quickly after it has been taken out.
取出的锡膏要尽快实施印刷使用。
■Atoms in the solder joints move as a result of both diffusion and electromigration.
另一方面,扩散和电迁移效应,则造成焊点中的原子移动。
■Only partial removal of the contaminated solder pot will get the Pb concentration back below 0.1% wt.
只有将被污染的焊料槽部分取下才可以让铅浓度恢复到重量0.1%以下。
■The reflow/extraction process should be carried out in accordance with J-STD-004 for the solder preforms.
可以按照针对预焊料的提取的J-STD-004进行回流/提取过程。
■Available with threaded (-UT), solder (-US), PEX or CPVC connections.
可提供螺纹连接(-UT),焊接连接(-US),PEX或CPVC连接方式。
■Settable for dipping time. Used solder cup to bring up tin from pot.
可设定焊锡时间,采用子式锡杯,母式锡炉.
■The liquidus temperature increases with increasing Ag % of the solder.
合金之液相线温度随银含量增加而提高。